In this announcement, the companies unveiled plans to create next-generation cores that minimize insertion loss and provide the highest performance options for data centers and large-scale customers of high-performance computing applications. The idea is to create a platform that is among the most powerful, with the largest bandwidth, in this sector. The companies are also looking to develop “a vertically-coupled detachable fiber-to-PIC (photonic integrated circuit) solution,” which could lead to further PI ...