The Ultra ECDP System Delivers Superior Uniformity and Minimized Undercut for High-Precision Au Bump, Thin Film, and Deep-Hole DeplatingFREMONT, Calif., Sept. 17, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced the launch of its first Ultra ECDP Electrochemical Deplating (“Ultra ECDP”) tool specifically designed for wide bandgap compound semiconductor manufact ...

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