3M participates in JOINT3, a next-generation semiconductor packaging consortium
JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from organic materials that connect different parts of an electronic device, helping to manage electrical signals and power between components. Continue Reading Accessibility StatementSkip Navigation ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor pa ...