Joint innovation enables ultra-high bandwidth, low latency, high radix, and energy efficiency for multi-rack AI clusters Co-packaged optics solution Alchip Technologies and Ayar Labs revealed a scale model of their joint co-packaged optics solution for AI datacenter scale-up at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum. SAN JOSE, Calif., Sept. 26, 2025 (GLOBE NEWSWIRE) -- At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Alchip Technologies, ...