Accessibility StatementSkip Navigation AI-Driven EDA and Broad IP Solutions Enable Differentiated Designs on TSMC Advanced Processes and SoIC Technologies Key Highlights SUNNYVALE, Calif., Sept. 24, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC's leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design. The ...